One-piece pads with
Self-contained 183°C melting point pad
Direct soldering saves time and labor
Fixes unrecordable
Face ID is not available,
Deep Sense Failure, etc.
No soldering spacer
No need for tedious operation.
Soldering in 10 seconds
Imported 16-pin
Specialized MCU, high stability
A1 pin marking.
Easy to recognize chip 1 pin position
Suitable for i2C brand face read/write devices